silicon-on-sapphire technology
type: Concept
preferred label: tecnología SOS @es
preferred label: technologie silicium-sur-saphir @fr

butt joint
type: Concept
preferred label: junta plana @es
preferred label: assemblage bout à bout @fr

brazed or soldered joint
type: Concept
preferred label: ensambladura broncesoldada @es
preferred label: assemblage brasé @fr

PMOS technology
type: Concept
preferred label: tecnología PMOS @es
preferred label: technologie PMOS @fr

radiofrequency sputtering
type: Concept
preferred label: pulverización de alta frecuencia @es
preferred label: pulvérisation à haute fréquence @fr

LGA technology
type: Concept
preferred label: tecnología LGA @es
preferred label: technologie LGA @fr

laser beam etching
type: Concept
preferred label: gravure par faisceau laser @fr
preferred label: grabado por láser @es

laser soldering
type: Concept
preferred label: soldeo blando por láser @es
preferred label: brasage tendre par laser @fr

common emitter
type: Concept
preferred label: montaje en emisor común @es
preferred label: montage en émetteur commun @fr

electron beam lithography
type: Concept
preferred label: lithographie par faisceau d'électrons @fr
preferred label: litografía por haz de electrónes @es

dry process
type: Concept
preferred label: procedimiento por vía seca @es
preferred label: procédé par voie sèche @fr

data encapsulation
type: Concept
preferred label: encapsulation de donnée @fr
preferred label: encapsulación de dato @es

micromachining
type: Concept
preferred label: micro-usinage @fr
preferred label: micromaquinado @es

cladding
type: Concept
preferred label: chapado por soldadura @es
preferred label: placage par soudage @fr

lead bonding
type: Concept
preferred label: soudage de connexion @fr
preferred label: soldadura de conexión @es

resistless lithography
type: Concept
preferred label: litografía sin resist @es
preferred label: lithographie sans résist @fr

cascode connection
type: Concept
preferred label: montage en cascode @fr
preferred label: montaje en cascode @es

floating gate technology
type: Concept
preferred label: technologie à grille flottante @fr
preferred label: tecnología de rejilla flotante @es

soldered joint
type: Concept
preferred label: assemblage par brasage tendre @fr
preferred label: junta soldada @es

rapid prototyping
type: Concept
preferred label: prototipado rápido @es
preferred label: prototypage rapide @fr

SBU technology
type: Concept
preferred label: tecnología SBU @es
preferred label: technologie SBU @fr

self aligned technology
type: Concept
preferred label: tecnología autoalineada @es
preferred label: technologie autoalignée @fr

integrated circuit packaging
type: Concept
preferred label: packaging de circuit intégré @fr
preferred label: packaging de circuito integrado @es

optical workshop technique
type: Concept
preferred label: técnica de taller óptico @es
preferred label: technique d'atelier optique @fr

plasma etching
type: Concept
preferred label: grabado por plasma @es
preferred label: gravure par plasma @fr

molecular beam condensation
type: Concept
preferred label: condensation de faisceau moléculaire @fr
preferred label: condensación de haz molecular @es

immersion technique
type: Concept
preferred label: technique d'immersion @fr
preferred label: técnica de inmersión @es

offset
type: Concept
preferred label: impresión offset @es
preferred label: impression à plat @fr

integrated circuit technology
type: Concept
preferred label: technologie de circuit intégré @fr
preferred label: tecnología de circuito integrado @es

film growth
type: Concept
preferred label: croissance de film @fr
preferred label: crecimiento de capa @es

solid source molecular beam epitaxy
type: Concept
preferred label: método SSMBE @es
preferred label: méthode SSMBE @fr

anisotropic etching
type: Concept
preferred label: gravure anisotrope @fr
preferred label: grabado anisótropo @es

thermal writing
type: Concept
preferred label: escritura térmica @es
preferred label: écriture thermique @fr

contact process
type: Concept
preferred label: procedimiento de contacto @es
preferred label: procédé de contact @fr

direct analog synthesis
type: Concept
preferred label: synthèse analogique directe @fr
preferred label: síntesis analógica directa @es

push push connection
type: Concept
preferred label: montage push-push @fr
preferred label: montaje push-push @es

UNIBOND technology
type: Concept
preferred label: technologie UNIBOND @fr
preferred label: tecnología UNIBOND @es

substrate integration
type: Concept
preferred label: intégration sur substrat @fr
preferred label: integración sobre susbtrato @es

modular design
type: Concept
preferred label: concepción modular @es
preferred label: conception modulaire @fr

tape film transfer
type: Concept
preferred label: transferencia de banda de película @es
preferred label: transfert de bande de film @fr

ion beam condensation
type: Concept
preferred label: condensación de haz de iones @es
preferred label: condensation de faisceau d'ions @fr

series parallel connection
type: Concept
preferred label: montage en série-parallèle @fr
preferred label: montaje en serie-paralelo @es

electronic packaging
type: Concept
preferred label: packaging électronique @fr
preferred label: packaging electrónico @es

circuit layout
type: Concept
preferred label: implantación de circuito @es
preferred label: implantation de circuit @fr

trench technology
type: Concept
preferred label: tecnología de trinchera @es
preferred label: technologie de tranchée @fr

sputtering
type: Concept
preferred label: pulvérisation par irradiation @fr
preferred label: pulverización por irradiación @es

silicon-on-insulator technology
type: Concept
preferred label: technologie silicium-sur-isolant @fr
preferred label: tecnología SOI @es

miniaturization
type: Concept
preferred label: miniaturización @es
preferred label: miniaturisation @fr

laser brazing
type: Concept
preferred label: brasage fort par laser @fr
preferred label: soldeo fuerte por láser @es

electron beam brazing
type: Concept
preferred label: brasage par faisceau d'électron @fr
preferred label: soldeo por haz de electrones @es

trenchless technology
type: Concept
preferred label: tecnología sin zanja @es
preferred label: technologie sans tranchée @fr

wafer-scale integration
type: Concept
preferred label: intégration sur plaquette @fr
preferred label: integración a escala de oblea @es

design aid
type: Concept
preferred label: ayuda para el diseño @es
preferred label: aide à la conception @fr

coating process
type: Concept
preferred label: procedimiento de revestimiento @es
preferred label: procédé de revêtement @fr

direct digital synthesis
type: Concept
preferred label: synthèse numérique directe @fr
preferred label: síntesis numérica directa @es

plastic packaging
type: Concept
preferred label: encapsulation en boîtier plastique @fr
preferred label: encapsulación en paquete de plástico @es

electron beam writing
type: Concept
preferred label: écriture par faisceau d'électrons @fr
preferred label: escritura por haz de electrónes @es

semiconductor growth
type: Concept
preferred label: croissance de semiconducteur @fr
preferred label: crecimiento de semiconductor @es

coating
type: Concept
preferred label: enduccion @es
preferred label: enduction @fr

contactless technology
type: Concept
preferred label: tecnología sin contacto @es
preferred label: technologie sans contact @fr

surface preparation
type: Concept
preferred label: preparación de superficie @es
preferred label: préparation de surface @fr

photoelectrochemical etching
type: Concept
preferred label: grabado fotoelectroquímico @es
preferred label: gravure photoélectrochimique @fr

damascene process
type: Concept
preferred label: damasquinado @es
preferred label: damasquinage @fr

split gate technology
type: Concept
preferred label: tecnología split-gate @es
preferred label: technologie porte fractionnée @fr

silicon-on-nothing technology
type: Concept
preferred label: tecnología SON @es
preferred label: technologie silicium-sur-rien @fr

high-level synthesis
type: Concept
preferred label: síntesis de alto nivel @es
preferred label: synthèse de haut niveau @fr

photolithography
type: Concept
preferred label: fotolitografía @es
preferred label: photolithographie @fr

pulsed laser deposition
type: Concept
preferred label: dépôt par laser pulsé @fr
preferred label: deposición por láser pulsado @es

thermomagnetic writing
type: Concept
preferred label: escritura termomagnética @es
preferred label: écriture thermomagnétique @fr

lead free soldering
type: Concept
preferred label: brasage sans plomb @fr
preferred label: soldeo sin plomo @es

splicing
type: Concept
preferred label: empalme @es
preferred label: épissage @fr

encapsulation
type: Concept
preferred label: encapsulación @es

ion implantation
type: Concept
preferred label: implantación iónica @es
preferred label: implantation d'ions @fr

high-temperature brazing
type: Concept
preferred label: soldeo de alta temperatura @es
preferred label: brasage à haute température @fr

planarization
type: Concept
preferred label: planarización @es
preferred label: planarisation @fr

electrophoretic coating technique
type: Concept
preferred label: méthode de revêtement électrophorétique @fr
preferred label: método de revestimiento electroforético @es

logic design
type: Concept
preferred label: conception logique @fr
preferred label: diseño lógico @es

circuit synthesis
type: Concept
preferred label: synthèse de circuit @fr
preferred label: síntesis de circuito @es

lateral growth
type: Concept
preferred label: croissance latérale @fr
preferred label: crecimiento lateral @es

nanoimprint
type: Concept
preferred label: nanoimpression @fr
preferred label: nanoimpresión @es

Darlington circuit
type: Concept
preferred label: montaje en Darlington @es
preferred label: montage en Darlington @fr

thermocompression welding
type: Concept
preferred label: soudage par thermocompression @fr
preferred label: soldadura por termocompresión @es

chip-on-board packaging
type: Concept
preferred label: tecnología COB @es
preferred label: technologie puce-sur-carte @fr

ultrasonic bonding
type: Concept
preferred label: soldadura ultrasónica @es
preferred label: assemblage par ultrasons @fr

PSGA technology
type: Concept
preferred label: technologie PSGA @fr
preferred label: tecnología OSGA @es

ion beam sputtering
type: Concept
preferred label: pulvérisation par faisceau d'ions @fr
preferred label: pulverización por haz de iones @es

circuit optimization
type: Concept
preferred label: optimización de circuito @es
preferred label: optimisation de circuit @fr

implementation
type: Concept
preferred label: implementación @es
preferred label: implémentation @fr

optimal design
type: Concept
preferred label: conception optimale @fr
preferred label: concepción optimal @es

Technique / Method
type: ConceptGroup
preferred label: Technique / Méthode @fr
type: Collection
sub group: Conception

Conception
type: Collection
member: trenchless technology
member: parallel connection
member: printed circuit layout
member: offset
member: virtual prototyping
member: sputtering
member: push pull connection
member: cathodic sputtering
member: MOVPE method
member: mechanical joint
member: electron beam writing
member: common grid configuration
member: nanoimprint lithography
member: solid-phase epitaxy
member: lead bonding
member: ultrasonic soldering
member: laser beam machining
member: chemical processing
member: thermal writing
member: tandem mount
member: design aid
member: common source configuration
member: extrusion coating
member: substrate integration
member: coating
member: insulation technology
member: typographic printing
member: surface preparation
member: back-end-of-line technology
member: pulsed laser deposition
member: PECVD
member: common drain configuration
member: physical vapor deposition
member: vertical integration
member: chemical-beam epitaxy
member: circuit synthesis
member: resistless lithography
member: plasma etching
member: microassembling
member: plastic packaging
member: photoelectrochemical etching
member: CGA technology
member: compact design
member: induction soldering
member: nanomanipulación
member: lateral etching
member: solid source molecular beam epitaxy
member: PSGA technology
member: high-level synthesis
member: BIFET technology
member: UV lithography
member: circuit layout
member: chip-on-board packaging
member: UNIBOND technology
member: microwave technology
member: surface mount technology
member: nanolithography
member: powder in tube technique
member: direct digital synthesis
member: laser writing
member: electrochemical etching
member: tape automatic bonding
member: transfer processing
member: manufacturing process
member: splicing
member: electron beam lithography
member: dip soldering
member: damascene process
member: vapor-phase epitaxy
member: modified chemical vapor deposition
member: flip-chip bonding
member: miniaturization
member: etching
member: selective growth
member: semiconductor device metallizing
member: circuit optimization
member: integrated circuit metallizing
member: dry etching
member: tape film transfer

parallel connection
type: Concept
preferred label: montage en parallèle @fr
preferred label: montaje en derivación @es

printed circuit layout
type: Concept
preferred label: implantation de circuit imprimé @fr
preferred label: implantación de circuito imprimido @es

virtual prototyping
type: Concept
preferred label: prototypage virtuel @fr
preferred label: prototipado virtual @es

push pull connection
type: Concept
preferred label: montage push-pull @fr
preferred label: montaje push-pull @es

cathodic sputtering
type: Concept
preferred label: pulverización catódica @es
preferred label: pulvérisation cathodique @fr

MOVPE method
type: Concept
preferred label: método MOVPE @es
preferred label: méthode MOVPE @fr

mechanical joint
type: Concept
preferred label: assemblage mécanique @fr
preferred label: junta mecánica @es

common grid configuration
type: Concept
preferred label: configuración de rejilla común @es
preferred label: montage à grille commune @fr

nanoimprint lithography
type: Concept
preferred label: lithographie par nanoimpression @fr
preferred label: litografía por nanoimpresión @es

solid-phase epitaxy
type: Concept
preferred label: epitaxia en fase sólida @es
preferred label: épitaxie en phase solide @fr

ultrasonic soldering
type: Concept
preferred label: soldeo ultrasonido @es
preferred label: brasage par ultrason @fr

laser beam machining
type: Concept
preferred label: usinage laser @fr
preferred label: maquinado por láser @es

chemical processing
type: Concept
preferred label: preparación por vía química @es
preferred label: préparation par voie chimique @fr

tandem mount
type: Concept
preferred label: montaje en tándem @es
preferred label: montage en tandem @fr

common source configuration
type: Concept
preferred label: montaje en surtidor común @es
preferred label: montage en source commune @fr

extrusion coating
type: Concept
preferred label: revestimiento elaborado por extrusión @es
preferred label: dépôt par extrusion @fr

insulation technology
type: Concept
preferred label: tecnología de aislamiento @es
preferred label: technologie d'isolation @fr

typographic printing
type: Concept
preferred label: impression typographique @fr
preferred label: impresión tipografica @es

back-end-of-line technology
type: Concept
preferred label: tecnología BEOL @es
preferred label: technologie BEOL @fr

PECVD
type: Concept
preferred label: método PECVD @es
preferred label: méthode PECVD @fr

common drain configuration
type: Concept
preferred label: montage à drain commun @fr
preferred label: configuración de drenador común @es

physical vapor deposition
type: Concept
preferred label: dépôt physique en phase vapeur @fr
preferred label: deposición física en fase vapor @es

vertical integration
type: Concept
preferred label: intégration verticale @fr
preferred label: integración vertical @es

chemical-beam epitaxy
type: Concept
preferred label: epitaxia por haz químico @es
preferred label: épitaxie par jet chimique @fr

microassembling
type: Concept
preferred label: micromontaje @es
preferred label: micro-assemblage @fr

CGA technology
type: Concept
preferred label: tecnología CGA @es
preferred label: technologie CGA @fr

compact design
type: Concept
preferred label: conception compacte @fr
preferred label: concepción compacta @es

induction soldering
type: Concept
preferred label: soldeo blando por inducción @es
preferred label: brasage tendre par induction @fr

nanomanipulación
type: Concept
preferred label: nanomanipulation

lateral etching
type: Concept
preferred label: grabado lateral @es
preferred label: gravure latérale @fr

BIFET technology
type: Concept
preferred label: technologie BIFET @fr
preferred label: tecnología BIFET @es

UV lithography
type: Concept
preferred label: lithographie UV @fr
preferred label: litografía UV @es

microwave technology
type: Concept
preferred label: technologie hyperfréquence @fr
preferred label: tecnología hiperfrecuencia @es

surface mount technology
type: Concept
preferred label: montage en surface @fr
preferred label: tecnología de montaje superficial @es

nanolithography
type: Concept
preferred label: nanolithographie @fr
preferred label: nanolitografía @es

powder in tube technique
type: Concept
preferred label: técnica de polvo en tubo @es
preferred label: technique de poudre dans tube @fr

laser writing
type: Concept
preferred label: écriture laser @fr
preferred label: escritura láser @es

electrochemical etching
type: Concept
preferred label: grabado electroquímico @es
preferred label: gravure électrochimique @fr

tape automatic bonding
type: Concept
preferred label: transfert automatique sur bande @fr
preferred label: transferencia automática en banda @es

transfer processing
type: Concept
preferred label: procédé de transfert @fr
preferred label: procesamiento de transferencia @es

manufacturing process
type: Concept
preferred label: procedimiento de fabricación @es
preferred label: procédé de fabrication @fr

dip soldering
type: Concept
preferred label: brasage tendre trempé @fr
preferred label: soldeo blando temple @es

vapor-phase epitaxy
type: Concept
preferred label: épitaxie en phase vapeur @fr
preferred label: epitaxia en fase vapor @es

modified chemical vapor deposition
type: Concept
preferred label: dépôt chimique en phase vapeur modifié @fr
preferred label: deposición química en fase vapor modificada @es

flip-chip bonding
type: Concept
preferred label: conexión invertida @es
preferred label: connexion par billes @fr

etching
type: Concept
preferred label: grabado @es
preferred label: gravure @fr

selective growth
type: Concept
preferred label: croissance sélective @fr
preferred label: crecimiento selectivo @es

semiconductor device metallizing
type: Concept
preferred label: metalización de dispositivo semiconductor @es
preferred label: métallisation de dispositif semiconducteur @fr

integrated circuit metallizing
type: Concept
preferred label: metalización de circuito integrado @es
preferred label: métallisation de circuit intégré @fr

dry etching
type: Concept
preferred label: gravure sèche @fr
preferred label: grabado seco @es

advanced technology
type: Concept
preferred label: technologie avancée @fr
preferred label: tecnología avanzada @es

chip scale packaging
type: Concept
preferred label: tecnología CSP @es
preferred label: technologie CSP @fr

semiconductor-on-insulator technology
type: Concept
preferred label: technologie semiconducteur-sur-isolant @fr
preferred label: tecnología semiconductor sobre aislante @es

soldering
type: Concept
preferred label: soldeo blando @es
preferred label: brasage tendre @fr

MESA technology
type: Concept
preferred label: technologie MESA @fr
preferred label: tecnología MESA @es

growth from liquid
type: Concept
preferred label: método de fase líquida @es
preferred label: méthode phase liquide @fr

capless technology
type: Concept
preferred label: technologie sans encapsulant @fr
preferred label: tecnología capless @es

reactive sputtering
type: Concept
preferred label: pulvérisation réactive @fr
preferred label: pulverización reactiva @es

vapour phase soldering
type: Concept
preferred label: soldeo en fase vapor @es
preferred label: brasage en phase vapeur @fr

circuit partitioning
type: Concept
preferred label: partitionnement de circuit @fr
preferred label: partición de circuito @es

BiCMOS technology
type: Concept
preferred label: tecnología BiCMOS @es
preferred label: technologie BiCMOS @fr

electrodeposition
type: Concept
preferred label: deposición electrolítica @es
preferred label: dépôt électrolytique @fr

powder technology
type: Concept
preferred label: tecnología de polvos @es
preferred label: technologie des poudres @fr

semiconductor device packaging
type: Concept
preferred label: packaging de dispositif semiconducteur @fr
preferred label: packaging de dispositivo semiconductor @es

growth from vapor
type: Concept
preferred label: méthode phase vapeur @fr
preferred label: método de fase vapor @es

wafer bonding
type: Concept
preferred label: fixation de pastille @fr
preferred label: fijación de oblea @es

ceramic packaging
type: Concept
preferred label: encapsulation en boîtier céramique @fr
preferred label: encapsulación en paquete de cerámica @es

xerography
type: Concept
preferred label: xerografía @es
preferred label: xérographie @fr

NMOS technology
type: Concept
preferred label: technologie NMOS @fr
preferred label: tecnología NMOS @es

codesign
type: Concept
preferred label: conception conjointe @fr
preferred label: diseño conjunto @es

ion beam etching
type: Concept
preferred label: gravure par faisceau d'ions @fr
preferred label: grabado por haz de iones @es

photoetching
type: Concept
preferred label: fotograbado @es
preferred label: photogravure @fr

non-vacuum technology
type: Concept
preferred label: tecnología sin vacío @es
preferred label: technologie hors vide @fr

large scale integration
type: Concept
preferred label: integración LSI @es
preferred label: intégration LSI @fr

transfer printing
type: Concept
preferred label: impression par transfert @fr
preferred label: impresión transferencia @es

wiring
type: Concept
preferred label: câblage @fr
preferred label: colocación de cables @es

resistance brazing
type: Concept
preferred label: soldeo fuerte por corriente eléctrico @es
preferred label: brasage fort par résistance @fr

series connection
type: Concept
preferred label: montage en série @fr
preferred label: montaje en serie @es

fluxless brazing
type: Concept
preferred label: soldeo sin fundente @es
preferred label: brasage sans flux @fr

liquid encapsulation
type: Concept
preferred label: encapsulación líquida @es
preferred label: encapsulation liquide @fr

via-less connection
type: Concept
preferred label: connexion sans trou @fr
preferred label: conexión via-less @es

wave soldering
type: Concept
preferred label: brasage par vague @fr
preferred label: soldeo por onda @es

ion beam lithography
type: Concept
preferred label: lithographie par faisceau d'ions @fr
preferred label: litografía por haz de iones @es

coplanar technology
type: Concept
preferred label: tecnología coplanar @es
preferred label: technologie coplanaire @fr

maskless lithography
type: Concept
preferred label: litografía sin máscara @es
preferred label: lithographie sans masque @fr

dual rail technology
type: Concept
preferred label: tecnología de doble raíl @es
preferred label: technologie à double rail @fr

scanning probe lithography
type: Concept
preferred label: lithographie en champ proche @fr
preferred label: litografía de campo próximo @es

common base
type: Concept
preferred label: montaje en base común @es
preferred label: montage en base commune @fr

ion beam assisted deposition method
type: Concept
preferred label: méthode IBAD @fr
preferred label: método IBAD @es

successive ionic layer adsorption and reaction method
type: Concept
preferred label: méthode SILAR @fr
preferred label: método SILAR @es

focused ion beam technology
type: Concept
preferred label: tecnología de haz de iones focalizado @es
preferred label: technologie de faisceau d'ions focalisé @fr

silicon-germanium-on-insulator technology
type: Concept
preferred label: technologie silicium-germanium-sur-isolant @fr
preferred label: tecnología SGOI @es

chip-on-glass packaging
type: Concept
preferred label: technologie puce-sur-verre @fr
preferred label: tecnología COG @es

optical design technique
type: Concept
preferred label: technique de conception optique @fr
preferred label: técnica de diseño óptico @es

sputter etching
type: Concept
preferred label: gravure par pulvérisation @fr
preferred label: grabado por pulverización @es

sound reproduction
type: Concept
preferred label: reproduction de son @fr
preferred label: reproducción de sonido @es

very-large-scale integration
type: Concept
preferred label: intégration à très grande échelle @fr
preferred label: VLSI @es

lithography
type: Concept
preferred label: litografía @es
preferred label: lithographie @fr

non linear network synthesis
type: Concept
preferred label: synthèse de circuit non linéaire @fr
preferred label: síntesis de circuito no lineal @es

silicon direct bonding
type: Concept
preferred label: soldadura directa sobre silicio @es
preferred label: soudure directe sur silicium @fr

soft lithography
type: Concept
preferred label: lithographie douce @fr
preferred label: litografía suave @es

physical vapor transport method
type: Concept
preferred label: método PVT @es
preferred label: méthode PVT @fr

DBC technology
type: Concept
preferred label: technologie DBC @fr
preferred label: tecnología DBC @es

BGA technology
type: Concept
preferred label: technologie BGA @fr
preferred label: tecnología BGA @es

thermosonic bonding
type: Concept
preferred label: assemblage thermosonique @fr
preferred label: soldadura termosónica @es

plasma deposition
type: Concept
preferred label: depósito por plasma @es
preferred label: dépôt par plasma @fr

VMOS technology
type: Concept
preferred label: technologie VMOS @fr
preferred label: tecnología VMOS @es

pseudomorphic growth
type: Concept
preferred label: crecimiento pseudomórfico @es
preferred label: croissance pseudomorphique @fr

wafer-level packaging
type: Concept
preferred label: encapsulation sur tranche @fr
preferred label: encapsulación en nivel de oblea @es

laser printing
type: Concept
preferred label: impresión láser @es
preferred label: impression laser @fr

semiconductor technology
type: Concept
preferred label: tecnología de semiconductores @es
preferred label: technologie des semiconducteurs @fr

germanium on insulator technology
type: Concept
preferred label: technologie germanium-sur-isolant @fr
preferred label: tecnología germanio-sobre-aislante @es

circuit realization
type: Concept
preferred label: réalisation de circuit @fr
preferred label: realización de circuito @es

silicon gate technology
type: Concept
preferred label: technologie à grille de silicium @fr
preferred label: tecnología de rejilla de silicio @es

MOS technology
type: Concept
preferred label: technologie MOS @fr
preferred label: tecnología MOS @es

electron beam evaporation
type: Concept
preferred label: evaporación por bombardeo electrónico @es
preferred label: évaporation par faisceau d'électrons @fr

silicon-on-glass technology
type: Concept
preferred label: tecnología SOG @es
preferred label: technologie silicium-sur-verre @fr

integrated circuit layout
type: Concept
preferred label: implantation de circuit intégré @fr
preferred label: implantación de circuito integrado @es

laser welding
type: Concept
preferred label: soudage par laser @fr
preferred label: soldadura por láser @es

LIGA
type: Concept
preferred label: tecnología LIGA @es
preferred label: technologie LIGA @fr

contact printing
type: Concept
preferred label: tirage par contact @fr
preferred label: tiraje por contacto @es

roll-to-roll process
type: Concept
preferred label: procédé roll-to-roll @fr
preferred label: procesamiento rollo a rollo @es

complementary MOS technology
type: Concept
preferred label: technologie MOS complémentaire @fr
preferred label: tecnología MOS complementario @es

non welded joint
type: Concept
preferred label: junta no soldada @es
preferred label: assemblage non soudé @fr

reactive ion etching
type: Concept
preferred label: gravure ionique réactive @fr
preferred label: grabado iónico reactivo @es

diffusion soldering
type: Concept
preferred label: brasage tendre par diffusion @fr
preferred label: soldeo blando por difusión @es

vacuum soldering
type: Concept
preferred label: brasage tendre sous vide @fr
preferred label: soldeo blando en vacío @es

sputter coating
type: Concept
preferred label: dépôt par pulvérisation @fr
preferred label: deposición por pulverización @es

reflow soldering
type: Concept
preferred label: brasage avec refusion @fr
preferred label: soldeo con refusión @es

projection welding
type: Concept
preferred label: soudage par bossage @fr
preferred label: soldadura de resalto @es

planar technology
type: Concept
preferred label: tecnología planar @es
preferred label: technologie planaire @fr

baking
type: Concept
preferred label: cuisson au four @fr
preferred label: cocimiento al horno @es

direct writing
type: Concept
preferred label: escritura directa @es
preferred label: écriture directe @fr

small outline
type: Concept
preferred label: connexion courte @fr
preferred label: contorno pequeño @es

wire bonding
type: Concept
preferred label: unión por hilo @es
preferred label: microcâblage @fr

immersion method
type: Concept
preferred label: método de immersión @es
preferred label: méthode d'immersion @fr

miniaturized design
type: Concept
preferred label: concepción miniaturizada @es
preferred label: conception miniaturisée @fr

chemical beam condensation
type: Concept
preferred label: condensation de faisceau chimique @fr
preferred label: condensación de haz químico @es

MOMBE method
type: Concept
preferred label: méthode MOMBE @fr
preferred label: método MOMBE @es

stereolithography
type: Concept
preferred label: stéréolithographie @fr
preferred label: estereolitografía @es

integrated design
type: Concept
preferred label: diseño integrado @es
preferred label: conception intégrée @fr

integrated circuit bonding
type: Concept
preferred label: assemblage de circuit intégré @fr
preferred label: ensambladura de circuito integrado @es

LOCOS technology
type: Concept
preferred label: technologie LOCOS @fr
preferred label: tecnología LOCOS @es

surface micromachining
type: Concept
preferred label: micro-usinage de surface @fr
preferred label: micromaquinado de superficie @es

liquid-phase epitaxy
type: Concept
preferred label: épitaxie en phase liquide @fr
preferred label: epitaxia en fase líquida @es

brazing and soldering
type: Concept
preferred label: soldeo @es
preferred label: brasage @fr

inkjet printing
type: Concept
preferred label: impresión por inyección de tinta @es
preferred label: impression à jet d'encre @fr

current transformation
type: Concept
preferred label: transformación de circuito @es
preferred label: transformation de circuit @fr

grain growth
type: Concept
preferred label: croissance de grain @fr
preferred label: crecimiento de grano @es

wet process
type: Concept
preferred label: procedimiento por vía húmeda @es
preferred label: procédé par voie humide @fr

molecular-beam epitaxy
type: Concept
preferred label: épitaxie par jet moléculaire @fr
preferred label: epitaxia por haz molecular @es

system level integration
type: Concept
preferred label: intégration au niveau système @fr
preferred label: integración a nivel de sistema @es

X-ray lithography
type: Concept
preferred label: litografía RX @es
preferred label: lithographie RX @fr

multiple exposure method
type: Concept
preferred label: méthode d'exposition multiple @fr
preferred label: método de exposición múltiple @es

FFS technology
type: Concept
preferred label: technologie FFS @fr
preferred label: tecnología FFS @es

electroforming
type: Concept
preferred label: electroformación @es
preferred label: électroformage @fr

screen printing
type: Concept
preferred label: sérigraphie @fr
preferred label: serigrafía @es

selective etching
type: Concept
preferred label: gravure sélective @fr
preferred label: grabado selectivo @es

SIMOX technology
type: Concept
preferred label: technologie SIMOX @fr
preferred label: tecnología SIMOX @es

cascade connection
type: Concept
preferred label: montaje en cascada @es
preferred label: montage en cascade @fr

fine-pitch technology
type: Concept
preferred label: tecnología fine pitch @es
preferred label: technologie à pas fin @fr

dislocation etching
type: Concept
preferred label: grabado de dislocación @es
preferred label: gravure de dislocation @fr

roll-to-roll lithography
type: Concept
preferred label: litografía roll to roll @es
preferred label: lithographie rotative @fr

common collector configuration
type: Concept
preferred label: configuración de colector común @es
preferred label: montage à collecteur commun @fr

high-fidelity reproduction
type: Concept
preferred label: reproduction haute-fidélité @fr
preferred label: reproducción de alta fidelidad @es

optical implementation
type: Concept
preferred label: implementación óptica @es
preferred label: implémentation optique @fr

MOCVD
type: Concept
preferred label: méthode MOCVD @fr
preferred label: método MOCVD @es

bulk micromachining
type: Concept
preferred label: micromaquinado de substrato @es
preferred label: micro-usinage de substrat @fr

ultra large scale integration
type: Concept
preferred label: integración ULSI @es
preferred label: intégration ULSI @fr

bipolar technology
type: Concept
preferred label: technologie bipolaire @fr
preferred label: tecnología bipolar @es

complementary bipolar technology
type: Concept
preferred label: tecnología bipolar complementaria @es
preferred label: technologie bipolaire complémentaire @fr

crystal growth from vapors
type: Concept
preferred label: crecimiento de cristal en fase gaseosa @es
preferred label: croissance cristalline en phase vapeur @fr