xérographie
type: Concept
preferred label: xerografía @es
preferred label: xerography @en

technique d'immersion
type: Concept
preferred label: immersion technique @en
preferred label: técnica de inmersión @es

méthode PECVD
type: Concept
preferred label: método PECVD @es
preferred label: PECVD @en

packaging de dispositif semiconducteur
type: Concept
preferred label: semiconductor device packaging @en
preferred label: packaging de dispositivo semiconductor @es

technologie SIMOX
type: Concept
preferred label: SIMOX technology @en
preferred label: tecnología SIMOX @es

condensation de faisceau moléculaire
type: Concept
preferred label: molecular beam condensation @en
preferred label: condensación de haz molecular @es

lithographie sans résist
type: Concept
preferred label: resistless lithography @en
preferred label: litografía sin resist @es

procédé par voie humide
type: Concept
preferred label: procedimiento por vía húmeda @es
preferred label: wet process @en

reproduction haute-fidélité
type: Concept
preferred label: high-fidelity reproduction @en
preferred label: reproducción de alta fidelidad @es

écriture directe
type: Concept
preferred label: escritura directa @es
preferred label: direct writing @en

technique de poudre dans tube
type: Concept
preferred label: powder in tube technique @en
preferred label: técnica de polvo en tubo @es

conception intégrée
type: Concept
preferred label: diseño integrado @es
preferred label: integrated design @en

lithographie douce
type: Concept
preferred label: soft lithography @en
preferred label: litografía suave @es

pulvérisation réactive
type: Concept
preferred label: pulverización reactiva @es
preferred label: reactive sputtering @en

microcâblage
type: Concept
preferred label: unión por hilo @es
preferred label: wire bonding @en

synthèse de circuit non linéaire
type: Concept
preferred label: síntesis de circuito no lineal @es
preferred label: non linear network synthesis @en

technologie MOS
type: Concept
preferred label: tecnología MOS @es
preferred label: MOS technology @en

croissance de semiconducteur
type: Concept
preferred label: semiconductor growth @en
preferred label: crecimiento de semiconductor @es

procédé de revêtement
type: Concept
preferred label: procedimiento de revestimiento @es
preferred label: coating process @en

technologie à grille de silicium
type: Concept
preferred label: silicon gate technology @en
preferred label: tecnología de rejilla de silicio @es

intégration sur substrat
type: Concept
preferred label: substrate integration @en
preferred label: integración sobre susbtrato @es

technologie LOCOS
type: Concept
preferred label: LOCOS technology @en
preferred label: tecnología LOCOS @es

montage en source commune
type: Concept
preferred label: montaje en surtidor común @es
preferred label: common source configuration @en

technologie de tranchée
type: Concept
preferred label: trench technology @en
preferred label: tecnología de trinchera @es

préparation de surface
type: Concept
preferred label: preparación de superficie @es
preferred label: surface preparation @en

intégration au niveau système
type: Concept
preferred label: system level integration @en
preferred label: integración a nivel de sistema @es

technologie sans contact
type: Concept
preferred label: tecnología sin contacto @es
preferred label: contactless technology @en

encapsulation sur tranche
type: Concept
preferred label: encapsulación en nivel de oblea @es
preferred label: wafer-level packaging @en

damasquinage
type: Concept
preferred label: damasquinado @es
preferred label: damascene process @en

technologie hors vide
type: Concept
preferred label: tecnología sin vacío @es
preferred label: non-vacuum technology @en

technologie avancée
type: Concept
preferred label: advanced technology @en
preferred label: tecnología avanzada @es

brasage tendre trempé
type: Concept
preferred label: dip soldering @en
preferred label: soldeo blando temple @es

évaporation par faisceau d'électrons
type: Concept
preferred label: evaporación por bombardeo electrónico @es
preferred label: electron beam evaporation @en

technologie à pas fin
type: Concept
preferred label: tecnología fine pitch @es
preferred label: fine-pitch technology @en

brasage en phase vapeur
type: Concept
preferred label: vapour phase soldering @en
preferred label: soldeo en fase vapor @es

épitaxie en phase liquide
type: Concept
preferred label: liquid-phase epitaxy @en
preferred label: epitaxia en fase líquida @es

dépôt par pulvérisation
type: Concept
preferred label: sputter coating @en
preferred label: deposición por pulverización @es

brasage sans plomb
type: Concept
preferred label: lead free soldering @en
preferred label: soldeo sin plomo @es

technologie SBU
type: Concept
preferred label: tecnología SBU @es
preferred label: SBU technology @en

dépôt physique en phase vapeur
type: Concept
preferred label: deposición física en fase vapor @es
preferred label: physical vapor deposition @en

montage en tandem
type: Concept
preferred label: tandem mount @en
preferred label: montaje en tándem @es

méthode d'immersion
type: Concept
preferred label: método de immersión @es
preferred label: immersion method @en

intégration ULSI
type: Concept
preferred label: ultra large scale integration @en
preferred label: integración ULSI @es

gravure photoélectrochimique
type: Concept
preferred label: grabado fotoelectroquímico @es
preferred label: photoelectrochemical etching @en

épitaxie par jet moléculaire
type: Concept
preferred label: molecular-beam epitaxy @en
preferred label: epitaxia por haz molecular @es

intégration LSI
type: Concept
preferred label: integración LSI @es
preferred label: large scale integration @en

technologie puce-sur-carte
type: Concept
preferred label: chip-on-board packaging @en
preferred label: tecnología COB @es

montage en série
type: Concept
preferred label: montaje en serie @es
preferred label: series connection @en

brasage par vague
type: Concept
preferred label: soldeo por onda @es
preferred label: wave soldering @en

technologie silicium-sur-verre
type: Concept
preferred label: tecnología SOG @es
preferred label: silicon-on-glass technology @en

brasage tendre par diffusion
type: Concept
preferred label: soldeo blando por difusión @es
preferred label: diffusion soldering @en

implantation de circuit
type: Concept
preferred label: circuit layout @en
preferred label: implantación de circuito @es

dépôt chimique en phase vapeur modifié
type: Concept
preferred label: modified chemical vapor deposition @en
preferred label: deposición química en fase vapor modificada @es

technologie à double rail
type: Concept
preferred label: tecnología de doble raíl @es
preferred label: dual rail technology @en

technologie MESA
type: Concept
preferred label: MESA technology @en
preferred label: tecnología MESA @es

dépôt par plasma
type: Concept
preferred label: depósito por plasma @es
preferred label: plasma deposition @en

technologie UNIBOND
type: Concept
preferred label: UNIBOND technology @en
preferred label: tecnología UNIBOND @es

croissance de film
type: Concept
preferred label: film growth @en
preferred label: crecimiento de capa @es

réalisation de circuit
type: Concept
preferred label: circuit realization @en
preferred label: realización de circuito @es

implantation d'ions
type: Concept
preferred label: implantación iónica @es
preferred label: ion implantation @en

technologie autoalignée
type: Concept
preferred label: tecnología autoalineada @es
preferred label: self aligned technology @en

technologie VMOS
type: Concept
preferred label: VMOS technology @en
preferred label: tecnología VMOS @es

conception conjointe
type: Concept
preferred label: codesign @en
preferred label: diseño conjunto @es

gravure ionique réactive
type: Concept
preferred label: reactive ion etching @en
preferred label: grabado iónico reactivo @es

assemblage non soudé
type: Concept
preferred label: junta no soldada @es
preferred label: non welded joint @en

technologie LIGA
type: Concept
preferred label: LIGA @en
preferred label: tecnología LIGA @es

montage push-push
type: Concept
preferred label: push push connection @en
preferred label: montaje push-push @es

reproduction de son
type: Concept
preferred label: sound reproduction @en
preferred label: reproducción de sonido @es

écriture thermique
type: Concept
preferred label: thermal writing @en
preferred label: escritura térmica @es

soudage par bossage
type: Concept
preferred label: projection welding @en
preferred label: soldadura de resalto @es

montage en parallèle
type: Concept
preferred label: parallel connection @en
preferred label: montaje en derivación @es

synthèse analogique directe
type: Concept
preferred label: direct analog synthesis @en
preferred label: síntesis analógica directa @es

pulvérisation par irradiation
type: Concept
preferred label: sputtering @en
preferred label: pulverización por irradiación @es

brasage sans flux
type: Concept
preferred label: soldeo sin fundente @es
preferred label: fluxless brazing @en

connexion par billes
type: Concept
preferred label: conexión invertida @es
preferred label: flip-chip bonding @en

synthèse de circuit
type: Concept
preferred label: circuit synthesis @en
preferred label: síntesis de circuito @es

lithographie par nanoimpression
type: Concept
preferred label: litografía por nanoimpresión @es
preferred label: nanoimprint lithography @en

technologie PMOS
type: Concept
preferred label: tecnología PMOS @es
preferred label: PMOS technology @en

épitaxie en phase vapeur
type: Concept
preferred label: vapor-phase epitaxy @en
preferred label: epitaxia en fase vapor @es

brasage
type: Concept
preferred label: brazing and soldering @en
preferred label: soldeo @es

croissance cristalline en phase vapeur
type: Concept
preferred label: crecimiento de cristal en fase gaseosa @es
preferred label: crystal growth from vapors @en

photolithographie
type: Concept
preferred label: fotolitografía @es
preferred label: photolithography @en

technologie à grille flottante
type: Concept
preferred label: tecnología de rejilla flotante @es
preferred label: floating gate technology @en

technologie silicium-sur-saphir
type: Concept
preferred label: tecnología SOS @es
preferred label: silicon-on-sapphire technology @en

soudage par thermocompression
type: Concept
preferred label: thermocompression welding @en
preferred label: soldadura por termocompresión @es

gravure de dislocation
type: Concept
preferred label: grabado de dislocación @es
preferred label: dislocation etching @en

brasage à haute température
type: Concept
preferred label: high-temperature brazing @en
preferred label: soldeo de alta temperatura @es

conception optimale
type: Concept
preferred label: concepción optimal @es
preferred label: optimal design @en

gravure électrochimique
type: Concept
preferred label: grabado electroquímico @es
preferred label: electrochemical etching @en

dépôt par laser pulsé
type: Concept
preferred label: pulsed laser deposition @en
preferred label: deposición por láser pulsado @es

technologie BGA
type: Concept
preferred label: tecnología BGA @es
preferred label: BGA technology @en

technologie DBC
type: Concept
preferred label: DBC technology @en
preferred label: tecnología DBC @es

lithographie rotative
type: Concept
preferred label: litografía roll to roll @es
preferred label: roll-to-roll lithography @en

pulvérisation à haute fréquence
type: Concept
preferred label: radiofrequency sputtering @en
preferred label: pulverización de alta frecuencia @es

montage en cascade
type: Concept
preferred label: montaje en cascada @es
preferred label: cascade connection @en

technologie d'isolation
type: Concept
preferred label: insulation technology @en
preferred label: tecnología de aislamiento @es

technologie CGA
type: Concept
preferred label: CGA technology @en
preferred label: tecnología CGA @es

gravure anisotrope
type: Concept
preferred label: anisotropic etching @en
preferred label: grabado anisótropo @es

enduction
type: Concept
preferred label: coating @en
preferred label: enduccion @es

impression à jet d'encre
type: Concept
preferred label: impresión por inyección de tinta @es
preferred label: inkjet printing @en

technologie FFS
type: Concept
preferred label: tecnología FFS @es
preferred label: FFS technology @en

gravure par plasma
type: Concept
preferred label: grabado por plasma @es
preferred label: plasma etching @en

lithographie UV
type: Concept
preferred label: UV lithography @en
preferred label: litografía UV @es

sérigraphie
type: Concept
preferred label: screen printing @en
preferred label: serigrafía @es

encapsulation liquide
type: Concept
preferred label: liquid encapsulation @en
preferred label: encapsulación líquida @es

procédé de transfert
type: Concept
preferred label: transfer processing @en
preferred label: procesamiento de transferencia @es

brasage tendre
type: Concept
preferred label: soldeo blando @es
preferred label: soldering @en

lithographie par faisceau d'ions
type: Concept
preferred label: ion beam lithography @en
preferred label: litografía por haz de iones @es

impression à plat
type: Concept
preferred label: offset @en
preferred label: impresión offset @es

méthode MOCVD
type: Concept
preferred label: método MOCVD @es
preferred label: MOCVD @en

assemblage bout à bout
type: Concept
preferred label: junta plana @es
preferred label: butt joint @en

épitaxie par jet chimique
type: Concept
preferred label: chemical-beam epitaxy @en
preferred label: epitaxia por haz químico @es

brasage avec refusion
type: Concept
preferred label: reflow soldering @en
preferred label: soldeo con refusión @es

intégration verticale
type: Concept
preferred label: vertical integration @en
preferred label: integración vertical @es

brasage fort par résistance
type: Concept
preferred label: soldeo fuerte por corriente eléctrico @es
preferred label: resistance brazing @en

technologie sans encapsulant
type: Concept
preferred label: capless technology @en
preferred label: tecnología capless @es

assemblage par brasage tendre
type: Concept
preferred label: soldered joint @en
preferred label: junta soldada @es

montage en émetteur commun
type: Concept
preferred label: montaje en emisor común @es
preferred label: common emitter @en

technologie des poudres
type: Concept
preferred label: powder technology @en
preferred label: tecnología de polvos @es

lithographie RX
type: Concept
preferred label: X-ray lithography @en
preferred label: litografía RX @es

stéréolithographie
type: Concept
preferred label: stereolithography @en
preferred label: estereolitografía @es

épissage
type: Concept
preferred label: empalme @es
preferred label: splicing @en

intégration à très grande échelle
type: Concept
preferred label: very-large-scale integration @en
preferred label: VLSI @es

écriture par faisceau d'électrons
type: Concept
preferred label: electron beam writing @en
preferred label: escritura por haz de electrónes @es

technologie puce-sur-verre
type: Concept
preferred label: chip-on-glass packaging @en
preferred label: tecnología COG @es

technologie CSP
type: Concept
preferred label: chip scale packaging @en
preferred label: tecnología CSP @es

prototypage rapide
type: Concept
preferred label: prototipado rápido @es
preferred label: rapid prototyping @en

métallisation de dispositif semiconducteur
type: Concept
preferred label: metalización de dispositivo semiconductor @es
preferred label: semiconductor device metallizing @en

méthode de revêtement électrophorétique
type: Concept
preferred label: método de revestimiento electroforético @es
preferred label: electrophoretic coating technique @en

technologie semiconducteur-sur-isolant
type: Concept
preferred label: semiconductor-on-insulator technology @en
preferred label: tecnología semiconductor sobre aislante @es

technologie NMOS
type: Concept
preferred label: NMOS technology @en
preferred label: tecnología NMOS @es

technologie de faisceau d'ions focalisé
type: Concept
preferred label: focused ion beam technology @en
preferred label: tecnología de haz de iones focalizado @es

intégration sur plaquette
type: Concept
preferred label: integración a escala de oblea @es
preferred label: wafer-scale integration @en

gravure
type: Concept
preferred label: grabado @es
preferred label: etching @en

croissance latérale
type: Concept
preferred label: lateral growth @en
preferred label: crecimiento lateral @es

dépôt électrolytique
type: Concept
preferred label: deposición electrolítica @es
preferred label: electrodeposition @en

lithographie
type: Concept
preferred label: litografía @es
preferred label: lithography @en

encapsulation en boîtier céramique
type: Concept
preferred label: encapsulación en paquete de cerámica @es
preferred label: ceramic packaging @en

aide à la conception
type: Concept
preferred label: design aid @en
preferred label: ayuda para el diseño @es

lithographie par faisceau d'électrons
type: Concept
preferred label: electron beam lithography @en
preferred label: litografía por haz de electrónes @es

miniaturisation
type: Concept
preferred label: miniaturization @en
preferred label: miniaturización @es

dépôt par extrusion
type: Concept
preferred label: revestimiento elaborado por extrusión @es
preferred label: extrusion coating @en

montage en Darlington
type: Concept
preferred label: montaje en Darlington @es
preferred label: Darlington circuit @en

gravure sélective
type: Concept
preferred label: selective etching @en
preferred label: grabado selectivo @es

méthode IBAD
type: Concept
preferred label: ion beam assisted deposition method @en
preferred label: método IBAD @es

conception miniaturisée
type: Concept
preferred label: miniaturized design @en
preferred label: concepción miniaturizada @es

implémentation
type: Concept
preferred label: implementación @es
preferred label: implementation @en

packaging de circuit intégré
type: Concept
preferred label: integrated circuit packaging @en
preferred label: packaging de circuito integrado @es

synthèse de haut niveau
type: Concept
preferred label: síntesis de alto nivel @es
preferred label: high-level synthesis @en

technologie bipolaire complémentaire
type: Concept
preferred label: tecnología bipolar complementaria @es
preferred label: complementary bipolar technology @en

technologie PSGA
type: Concept
preferred label: tecnología OSGA @es
preferred label: PSGA technology @en

pulvérisation par faisceau d'ions
type: Concept
preferred label: ion beam sputtering @en
preferred label: pulverización por haz de iones @es

conception modulaire
type: Concept
preferred label: modular design @en
preferred label: concepción modular @es

implantation de circuit imprimé
type: Concept
preferred label: implantación de circuito imprimido @es
preferred label: printed circuit layout @en

montage à drain commun
type: Concept
preferred label: common drain configuration @en
preferred label: configuración de drenador común @es

placage par soudage
type: Concept
preferred label: cladding @en
preferred label: chapado por soldadura @es

fixation de pastille
type: Concept
preferred label: fijación de oblea @es
preferred label: wafer bonding @en

pulvérisation cathodique
type: Concept
preferred label: cathodic sputtering @en
preferred label: pulverización catódica @es

nanoimpression
type: Concept
preferred label: nanoimpresión @es
preferred label: nanoimprint @en

soudage de connexion
type: Concept
preferred label: lead bonding @en
preferred label: soldadura de conexión @es

brasage par ultrason
type: Concept
preferred label: ultrasonic soldering @en
preferred label: soldeo ultrasonido @es

lithographie en champ proche
type: Concept
preferred label: litografía de campo próximo @es
preferred label: scanning probe lithography @en

technologie silicium-sur-isolant
type: Concept
preferred label: tecnología SOI @es
preferred label: silicon-on-insulator technology @en

synthèse numérique directe
type: Concept
preferred label: direct digital synthesis @en
preferred label: síntesis numérica directa @es

technologie de circuit intégré
type: Concept
preferred label: integrated circuit technology @en
preferred label: tecnología de circuito integrado @es

assemblage thermosonique
type: Concept
preferred label: thermosonic bonding @en
preferred label: soldadura termosónica @es

méthode SILAR
type: Concept
preferred label: successive ionic layer adsorption and reaction method @en
preferred label: método SILAR @es

brasage par faisceau d'électron
type: Concept
preferred label: electron beam brazing @en
preferred label: soldeo por haz de electrones @es

montage en série-parallèle
type: Concept
preferred label: montaje en serie-paralelo @es
preferred label: series parallel connection @en

électroformage
type: Concept
preferred label: electroforming @en
preferred label: electroformación @es

méthode d'exposition multiple
type: Concept
preferred label: multiple exposure method @en
preferred label: método de exposición múltiple @es

conception compacte
type: Concept
preferred label: compact design @en
preferred label: concepción compacta @es

condensation de faisceau chimique
type: Concept
preferred label: chemical beam condensation @en
preferred label: condensación de haz químico @es

écriture thermomagnétique
type: Concept
preferred label: escritura termomagnética @es
preferred label: thermomagnetic writing @en

épitaxie en phase solide
type: Concept
preferred label: epitaxia en fase sólida @es
preferred label: solid-phase epitaxy @en

prototypage virtuel
type: Concept
preferred label: virtual prototyping @en
preferred label: prototipado virtual @es

technologie hyperfréquence
type: Concept
preferred label: microwave technology @en
preferred label: tecnología hiperfrecuencia @es

transfert de bande de film
type: Concept
preferred label: tape film transfer @en
preferred label: transferencia de banda de película @es

écriture laser
type: Concept
preferred label: escritura láser @es
preferred label: laser writing @en

photogravure
type: Concept
preferred label: fotograbado @es
preferred label: photoetching @en

brasage fort par laser
type: Concept
preferred label: laser brazing @en
preferred label: soldeo fuerte por láser @es

technologie germanium-sur-isolant
type: Concept
preferred label: germanium on insulator technology @en
preferred label: tecnología germanio-sobre-aislante @es

brasage tendre par laser
type: Concept
preferred label: soldeo blando por láser @es
preferred label: laser soldering @en

méthode phase vapeur
type: Concept
preferred label: growth from vapor @en
preferred label: método de fase vapor @es

technique d'atelier optique
type: Concept
preferred label: técnica de taller óptico @es
preferred label: optical workshop technique @en

technologie BIFET
type: Concept
preferred label: BIFET technology @en
preferred label: tecnología BIFET @es

nanolithographie
type: Concept
preferred label: nanolithography @en
preferred label: nanolitografía @es

technologie bipolaire
type: Concept
preferred label: bipolar technology @en
preferred label: tecnología bipolar @es

assemblage mécanique
type: Concept
preferred label: mechanical joint @en
preferred label: junta mecánica @es

technologie planaire
type: Concept
preferred label: tecnología planar @es
preferred label: planar technology @en

métallisation de circuit intégré
type: Concept
preferred label: metalización de circuito integrado @es
preferred label: integrated circuit metallizing @en

usinage laser
type: Concept
preferred label: laser beam machining @en
preferred label: maquinado por láser @es

technique de conception optique
type: Concept
preferred label: técnica de diseño óptico @es
preferred label: optical design technique @en

micro-usinage de surface
type: Concept
preferred label: micromaquinado de superficie @es
preferred label: surface micromachining @en

montage à grille commune
type: Concept
preferred label: configuración de rejilla común @es
preferred label: common grid configuration @en

procédé par voie sèche
type: Concept
preferred label: procedimiento por vía seca @es
preferred label: dry process @en

croissance pseudomorphique
type: Concept
preferred label: crecimiento pseudomórfico @es
preferred label: pseudomorphic growth @en

méthode MOMBE
type: Concept
preferred label: MOMBE method @en
preferred label: método MOMBE @es

montage en surface
type: Concept
preferred label: surface mount technology @en
preferred label: tecnología de montaje superficial @es

méthode phase liquide
type: Concept
preferred label: método de fase líquida @es
preferred label: growth from liquid @en

procédé roll-to-roll
type: Concept
preferred label: procesamiento rollo a rollo @es
preferred label: roll-to-roll process @en

transformation de circuit
type: Concept
preferred label: transformación de circuito @es
preferred label: current transformation @en

assemblage brasé
type: Concept
preferred label: ensambladura broncesoldada @es
preferred label: brazed or soldered joint @en

implémentation optique
type: Concept
preferred label: implementación óptica @es
preferred label: optical implementation @en

cuisson au four
type: Concept
preferred label: baking @en
preferred label: cocimiento al horno @es

méthode SSMBE
type: Concept
preferred label: método SSMBE @es
preferred label: solid source molecular beam epitaxy @en

micro-assemblage
type: Concept
preferred label: micromontaje @es
preferred label: microassembling @en

procédé de contact
type: Concept
preferred label: procedimiento de contacto @es
preferred label: contact process @en

montage push-pull
type: Concept
preferred label: push pull connection @en
preferred label: montaje push-pull @es

nanomanipulation
type: Concept
preferred label: nanomanipulación @es

technologie silicium-sur-rien
type: Concept
preferred label: tecnología SON @es
preferred label: silicon-on-nothing technology @en

planarisation
type: Concept
preferred label: planarization @en
preferred label: planarización @es

technologie BEOL
type: Concept
preferred label: back-end-of-line technology @en
preferred label: tecnología BEOL @es

technologie des semiconducteurs
type: Concept
preferred label: tecnología de semiconductores @es
preferred label: semiconductor technology @en

impression typographique
type: Concept
preferred label: typographic printing @en
preferred label: impresión tipografica @es

conception logique
type: Concept
preferred label: diseño lógico @es
preferred label: logic design @en

connexion courte
type: Concept
preferred label: small outline @en
preferred label: contorno pequeño @es

partitionnement de circuit
type: Concept
preferred label: partición de circuito @es
preferred label: circuit partitioning @en

technologie LGA
type: Concept
preferred label: tecnología LGA @es
preferred label: LGA technology @en

brasage tendre sous vide
type: Concept
preferred label: soldeo blando en vacío @es
preferred label: vacuum soldering @en

montage à collecteur commun
type: Concept
preferred label: common collector configuration @en
preferred label: configuración de colector común @es

impression par transfert
type: Concept
preferred label: transfer printing @en
preferred label: impresión transferencia @es

technologie silicium-germanium-sur-isolant
type: Concept
preferred label: silicon-germanium-on-insulator technology @en
preferred label: tecnología SGOI @es

tirage par contact
type: Concept
preferred label: contact printing @en
preferred label: tiraje por contacto @es

gravure latérale
type: Concept
preferred label: grabado lateral @es
preferred label: lateral etching @en

assemblage de circuit intégré
type: Concept
preferred label: ensambladura de circuito integrado @es
preferred label: integrated circuit bonding @en

condensation de faisceau d'ions
type: Concept
preferred label: condensación de haz de iones @es
preferred label: ion beam condensation @en

technologie coplanaire
type: Concept
preferred label: tecnología coplanar @es
preferred label: coplanar technology @en

montage en base commune
type: Concept
preferred label: montaje en base común @es
preferred label: common base @en

gravure par pulvérisation
type: Concept
preferred label: grabado por pulverización @es
preferred label: sputter etching @en

technologie sans tranchée
type: Concept
preferred label: tecnología sin zanja @es
preferred label: trenchless technology @en

transfert automatique sur bande
type: Concept
preferred label: tape automatic bonding @en
preferred label: transferencia automática en banda @es

méthode MOVPE
type: Concept
preferred label: MOVPE method @en
preferred label: método MOVPE @es

micro-usinage
type: Concept
preferred label: micromachining @en
preferred label: micromaquinado @es

connexion sans trou
type: Concept
preferred label: via-less connection @en
preferred label: conexión via-less @es

technologie MOS complémentaire
type: Concept
preferred label: tecnología MOS complementario @es
preferred label: complementary MOS technology @en

gravure par faisceau d'ions
type: Concept
preferred label: grabado por haz de iones @es
preferred label: ion beam etching @en

technologie BiCMOS
type: Concept
preferred label: BiCMOS technology @en
preferred label: tecnología BiCMOS @es

soudure directe sur silicium
type: Concept
preferred label: soldadura directa sobre silicio @es
preferred label: silicon direct bonding @en

lithographie sans masque
type: Concept
preferred label: maskless lithography @en
preferred label: litografía sin máscara @es

gravure sèche
type: Concept
preferred label: dry etching @en
preferred label: grabado seco @es

câblage
type: Concept
preferred label: wiring @en
preferred label: colocación de cables @es

encapsulation de donnée
type: Concept
preferred label: data encapsulation @en
preferred label: encapsulación de dato @es

procédé de fabrication
type: Concept
preferred label: manufacturing process @en
preferred label: procedimiento de fabricación @es

préparation par voie chimique
type: Concept
preferred label: preparación por vía química @es
preferred label: chemical processing @en

encapsulación
type: Concept
preferred label: encapsulation

croissance de grain
type: Concept
preferred label: grain growth @en
preferred label: crecimiento de grano @es

soudage par laser
type: Concept
preferred label: laser welding @en
preferred label: soldadura por láser @es

assemblage par ultrasons
type: Concept
preferred label: ultrasonic bonding @en
preferred label: soldadura ultrasónica @es

packaging électronique
type: Concept
preferred label: electronic packaging @en
preferred label: packaging electrónico @es

gravure par faisceau laser
type: Concept
preferred label: laser beam etching @en
preferred label: grabado por láser @es

encapsulation en boîtier plastique
type: Concept
preferred label: plastic packaging @en
preferred label: encapsulación en paquete de plástico @es

montage en cascode
type: Concept
preferred label: montaje en cascode @es
preferred label: cascode connection @en

optimisation de circuit
type: Concept
preferred label: optimización de circuito @es
preferred label: circuit optimization @en

croissance sélective
type: Concept
preferred label: selective growth @en
preferred label: crecimiento selectivo @es

implantation de circuit intégré
type: Concept
preferred label: integrated circuit layout @en
preferred label: implantación de circuito integrado @es

technologie porte fractionnée
type: Concept
preferred label: tecnología split-gate @es
preferred label: split gate technology @en

brasage tendre par induction
type: Concept
preferred label: induction soldering @en
preferred label: soldeo blando por inducción @es

micro-usinage de substrat
type: Concept
preferred label: micromaquinado de substrato @es
preferred label: bulk micromachining @en

impression laser
type: Concept
preferred label: impresión láser @es
preferred label: laser printing @en

méthode PVT
type: Concept
preferred label: physical vapor transport method @en
preferred label: método PVT @es

Conception
type: Collection
type: ConceptGroup
super group: Technique / Méthode
comment: Number of members: 261. @en
comment: Nombre de membres : 261.
in scheme: RDR
member: technologie sans tranchée
member: montage en parallèle
member: implantation de circuit imprimé
member: impression à plat
member: prototypage virtuel
member: pulvérisation par irradiation
member: montage push-pull
member: pulvérisation cathodique
member: méthode MOVPE
member: assemblage mécanique
member: écriture par faisceau d'électrons
member: montage à grille commune
member: lithographie par nanoimpression
member: épitaxie en phase solide
member: soudage de connexion
member: brasage par ultrason
member: usinage laser
member: préparation par voie chimique
member: écriture thermique
member: montage en tandem
member: aide à la conception
member: montage en source commune
member: dépôt par extrusion
member: intégration sur substrat
member: enduction
member: technologie d'isolation
member: impression typographique
member: préparation de surface
member: technologie BEOL
member: dépôt par laser pulsé
member: méthode PECVD
member: montage à drain commun
member: dépôt physique en phase vapeur
member: intégration verticale
member: épitaxie par jet chimique
member: synthèse de circuit
member: lithographie sans résist
member: gravure par plasma
member: micro-assemblage
member: encapsulation en boîtier plastique
member: gravure photoélectrochimique
member: technologie CGA
member: conception compacte
member: brasage tendre par induction
member: nanomanipulation
member: gravure latérale
member: méthode SSMBE
member: technologie PSGA
member: synthèse de haut niveau
member: technologie BIFET
member: lithographie UV
member: implantation de circuit
member: technologie puce-sur-carte
member: technologie UNIBOND
member: technologie hyperfréquence
member: montage en surface
member: nanolithographie
member: technique de poudre dans tube
member: synthèse numérique directe
member: écriture laser
member: gravure électrochimique
member: transfert automatique sur bande
member: procédé de transfert
member: procédé de fabrication
member: épissage
member: lithographie par faisceau d'électrons
member: brasage tendre trempé
member: damasquinage
member: épitaxie en phase vapeur
member: dépôt chimique en phase vapeur modifié
member: connexion par billes
member: miniaturisation
member: gravure
member: croissance sélective

Technique / Méthode
type: ConceptGroup
type: Collection
sub group: Conception
preferred label: Technique / Method @en